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MSDI · MISSILE DEFENSE

Extended SBL

반도체 · NeoPAC®

Extended SBL (Stress Buffer Layer)

  • Extended SBL은 Scribe Lane지역까지 SBL을 확장하여 Mechanical Sensor-sawing시 Sensor로 전이되는 Stress를 Release시켜 Chipping발생률을 현격히 개선시킨 기술입니다.
  • 해당기술의 적용은 Low-k Wafer Dicing을 위한 고가의 Laser Ablation장비를 사용하지 않아도 되며,
  • Sensor Sawing시 발생되는 Particle을 최소화 시킬수 있습니다.

Extended SBL기술의 Concept

대표이미지/High-power Scope, FE-SEM